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International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Conference in-person 8th to 10th October 2024 San Jose, California, United States of America Website: https://event.asme.org/InterPACK Contact person: Mary Jakubowski InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Organized by: ASME Deadline for abstracts/proposals: 19th February 2024 Check the event website for more details. View all events from this organizer.
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